Broadband D-Band Patch Antenna Array in Wafer-Level Package Based on BCB Process

This paper presents a broadband stacked patch antenna array in wafer-level package based on benzocyclobutene (BCB) process for D-band wireless communications. The BCB material is not only used as substrate the antenna, but also an interconnection layer, enabling low-loss with RFICs through vias and transmission lines. By introducing polymer-filled back cavity carefully developing feeding network, designed achieves relative bandwidth of 18.9 2W2 features stable high-gain broadside radiation pattern. pairwise antiphase technique adopted to suppress cross-polarization level. In order acquire high-speed data transmission, dual-polarization MIMO implementation presented. port isolations are greater than 35 dB across whole operating band.